Trooper-V is Pentamaster’s next level high speed AOI handler designed for wafer-level packages. In just 2 minutes, Trooper-V inspection system is able to inspect an entire wafer consisting of approximately 70,000 dies. With high quality objective lens, it allows for different levels of magnification to accommodate various types & sizes of dies.
It is available in 2 different designs depending on our customer’s requirements, one which allows it to operate in cleanrooms (Class level 10) and the other which is operate-able in standard production floors.
|Input/ Output Options||Raw Wafer (6”, 8” or 12”)
Mylar Wafer Ring (6”, 8” or 12”)
|Selection of Packages||Die, Silicon Carbide (SiC), CMOS Image Sensor, Flip Chip|
|Wafer Per Hour||+/- 30 Wafers|
|Vision Capabilities||Pre-Wafer Alignment (x, y and θ orientation)
Die Surface Inspection (Scratch, Crack, Chipping, Metal Peeling, Misaligned Cut, Foreign Material, Missing Die, Edge Bur, Edge Debris, Optical Character Recognition, Polyimide Peeling, Discoloration and Contamination)
Probe Mark Inspection (Size, Area and Position)
Wafer Saw Line Inspection
|Camera Technology||Short-Wave Infrared (SWIR) Imaging Technology
Lens Magnification Capabilities (2.0x, 5.0x, 7.5x magnification)
Illumination (Light source with RGB configuration)