LED Burn-In Oven System

LED Burn-In Oven System

It is designed to perform burn-in test onto certain type of LED products in tile form by placing them under high humidity, high temperature and high current to test the LEDs reliability & performance. It is a user-friendly solution with built in precision DMM for product monitoring and data acquisition capabilities.

  • Over Voltage Clamp
  • Individual LED Current and Voltage Monitoring
  • User-Defined Burn-in Profile (Continuous or Pulse Mode)
  • Customized LED Burn-in Station, One Substrate Tile Per Load, Maximum of 600 LEDs Per Tile
  • Programmable Current Settings
  • Scalable Constant Current Module
  • Programmable Temperature Control (Water Cooled)
  • PC Control, Real Time Acquisition and Display
 
General Specifications
Channel Number >600 per wafer unit
Burn-in Duration Programmable
Electrical Parameter Measurements Current Source Range
• 100mA~3,000mA
Current Measurement Tolerance
• 2mA or ±1%
Compliance Voltage
• 24VDC
Voltage Source Range
• 5~24VDC
Voltage Source Accuracy
• 20mV or ±1%
Programmable Temperature Control Temperature Measuring Control
• Ambient~130°C
Temperature Setting Range
• 45°C~130°C
Temperature Setting Resolution
• 0.1°C
Operation Temperature
• 20°C~30°C
Operation Humidity
• <85% RH, Non-Condensing
Additional Features • Chiller (optional)
• Real time display of go-no-go Vf & If measurements
• During system power up sources are disabled
• Anode & cathode pads of the substrate are electrically isolated
• Open or close circuit of DUT is detectable during burn-in
• Easy load and unloading of ceramic substrate tile
• Remote accessibility via LAN network connection
• Golden Unit Monitoring
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