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Our GIDEON series comprise of a single tray to tray handler which is dock-able onto either a single test cell or up to 3 test cells which helps to improve flexibility and reusability. They are highly customizable and configurable for various kinds of test methodologies, capable to cater a wide range of smart sensors such as Structured Light 3D Sensors, Proximity Sensors, Time of Flight 3D Sensors, Ambient Light Sensors and many more.
Package | Structured Light 3D Sensor |
UPH | Ranging from 600 to 1,200 (Depending on package & machine configuration) |
Input Options | JEDEC Tray |
Output Options | JEDEC Tray, Tape & Reel |
Reject Options | Canister Bins, JEDEC Tray |
Vision Capabilities |
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Vision Accuracy (depending on package type) | 10um |
Test Capabilities |
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Test Sites | Up to 6 or 12 test sites |
Test Contact Method | Punch Type |
Test Socket Options | Kelvin/Non-Kelvin |
Machine Features | Automated GR&R, Automated Golden Unit Monitoring, Automated Retest, Automated Yield Monitoring, Automated OQC Sampling, Automated Site/Nest Disabled, Automated Pogo Pins Cleaning, Lens Shading Correction, Distortion Correction, Light Calibration |
Package | Proximity Sensor |
UPH | Up to 3,200 (Depending on package & machine configuration) |
Input Options | JEDEC Tray |
Output Options | JEDEC Tray |
Reject Options | JEDEC Tray |
Vision Capabilities |
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Vision Accuracy (depending on package type) | – |
Test Capabilities |
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Test Sites | Up to 24 sites |
Test Contact Method | Punch Type |
Test Socket Options | Kelvin/Non-Kelvin |
Machine Features | Automated GR&R, Automated Golden Unit Monitoring, Automated Retest, Automated Yield Monitoring |
Package | Time of Flight 3D Sensor |
UPH | Up to 1,200 (Depending on package & machine configuration) |
Input Options | JEDEC Tray |
Output Options | JEDEC Tray, Tape & Reel |
Reject Options | JEDEC Tray |
Vision Capabilities |
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Vision Accuracy (depending on package type) | – |
Test Capabilities |
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Test Sites | Up to 12 test sites |
Test Contact Method | Probe Type |
Test Socket Options | Kelvin/Non-Kelvin |
Machine Features | Automated GR&R, Automated Golden Unit Monitoring, Automated Retest, Automated Yield Monitoring, Automated OQC Sampling Test |
Package | Ambient Light Sensor |
UPH | Up to 2,250 (Depending on package & machine configuration) |
Input Options | JEDEC Tray |
Output Options | JEDEC Tray |
Reject Options | JEDEC Tray |
Vision Capabilities |
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Vision Accuracy (depending on package type) | – |
Test Capabilities |
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Test Sites | Multiple Test Cells Up to 108 parallel test sites |
Test Contact Method | Punch Type |
Test Socket Options | Kelvin/Non-Kelvin |
Machine Features | Automated Golden Unit Monitoring, Spectrometer Audit Control, Automated GR&R, Automated Retest, Run Time Log, Automated Low Yield Monitoring, UPH Tracker, Automated Test Socket Disable |
Package | Image Sensor, Endoscope |
UPH | >500 (Depending on package & machine configuration) |
Input Options | Customized Tray |
Output Options | Customized Tray |
Reject Options | Customized Tray |
Vision Capabilities |
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Vision Accuracy (depending on package type) | – |
Test Capabilities |
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Test Sites | Up to 14 test sites |
Test Contact Method | Punch Type |
Test Socket Options | Kelvin/Non-Kelvin |
Machine Features | Programmable Light Source Color Temperature, Auto X, Y Rotation & Z Alignment, Automated Retest, Automated GR&R |
Package | Spectrum Sensor |
UPH | >500 (Depending on package & machine configuration) |
Input Options | JEDEC Tray |
Output Options | JEDEC Tray |
Reject Options | JEDEC Tray |
Vision Capabilities |
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Vision Accuracy (depending on package type) | – |
Test Capabilities |
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Test Sites | Up to 70 test sites |
Test Contact Method | Punch Type |
Test Socket Options | Kelvin/Non-Kelvin |
Machine Features | Automated GR&R, Autoamted Retest, Automated Yield Monitoring, Tray Mapping Integration |
Package | Micro LED |
UPH | >1,200 (Depending on package & machine configuration) |
Input Options | REL Board, JEDEC Tray |
Output Options | REL Board, JEDEC Tray |
Reject Options | REL Board |
Vision Capabilities |
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Vision Accuracy (depending on package type) | – |
Test Capabilities |
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Test Sites | – |
Test Contact Method | Punch Type |
Test Socket Options | Kelvin/Non-Kelvin |
Machine Features | – |