GIDEON

GIDEON

Our GIDEON series comprise of a single tray to tray handler which is dock-able onto either a single test cell or up to 3 test cells which helps to improve flexibility and reusability. They are highly customizable and configurable for various kinds of test methodologies, capable to cater a wide range of smart sensors such as Structured Light 3D Sensors, Proximity Sensors, Time of Flight 3D Sensors, Ambient Light Sensors and many more.

GIDEON’s Configurations/Specifications

Package Structured Light 3D Sensor
UPH Ranging from 600 to 1,200 (Depending on package & machine configuration)
Input Options JEDEC Tray
Output Options JEDEC Tray, Tape & Reel
Reject Options Canister Bins, JEDEC Tray
Vision Capabilities
  • 2D Matrix Inspection (2D Matrix Code Size down to 0.3mm x 0.3mm), 2D Matrix Fast Detection Algorithm, Fast Orientation Pattern Matching Algorithm)
  • DUT Position and Orientation (DUT X, Y, R Position, Orientation Mark Detection, Unit Presence)
  • 6-Sided AOI Inspection
  • System Alignment
Vision Accuracy (depending on package type) 10um
Test Capabilities
  • LIV Sweep & Wavelength Test (Open Short Test, Current Leakage, Forward Voltage, Operating Current, Operating Voltage, Optical Operating Power, Power Conversion Efficiency (PCE), Threshold Current, Differential Resistance, Power Slope Efficiency, Linearity (Kink), Diode Voltage Test, Wavelength Test)
  • Far Field Test (Geometrical & Pattern Mass Center Offset, Pattern Angle, Contrast Score, Energy/Power, Uniformity, Field Of Illumination (FOI), Hot Spot, Dot Count, Eye Safety Threshold, Center Intensity, Slope)
Test Sites Up to 6 or 12 test sites
Test Contact Method Punch Type
Test Socket Options Kelvin/Non-Kelvin
Machine Features Automated GR&R, Automated Golden Unit Monitoring, Automated Retest, Automated Yield Monitoring, Automated OQC Sampling, Automated Site/Nest Disabled, Automated Pogo Pins Cleaning, Lens Shading Correction, Distortion Correction, Light Calibration

Package Proximity Sensor
UPH Up to 3,200 (Depending on package & machine configuration)
Input Options JEDEC Tray
Output Options JEDEC Tray
Reject Options JEDEC Tray
Vision Capabilities
  • 2D Matrix Inspection
  • Dimension Measurement
Vision Accuracy (depending on package type)
Test Capabilities
  • LIV Sweep & Wavelength Test (Open Short Test, Current Leakage, Forward Voltage, Operating Current, Operating Voltage, Optical Operating Power, Power Conversion Efficiency (PCE), Threshold Current, Differential Resistance, Power Slope Efficiency, Linearity (Kink), Diode Voltage Test, Wavelength Test)
  • Angular & Module Reflectance Test
  • PD Test
  • Cross Talk Test
Test Sites Up to 24 sites
Test Contact Method Punch Type
Test Socket Options Kelvin/Non-Kelvin
Machine Features Automated GR&R, Automated Golden Unit Monitoring, Automated Retest, Automated Yield Monitoring

Package Time of Flight 3D Sensor
UPH Up to 1,200 (Depending on package & machine configuration)
Input Options JEDEC Tray
Output Options JEDEC Tray, Tape & Reel
Reject Options JEDEC Tray
Vision Capabilities
  • 2D Matrix Inspection
Vision Accuracy (depending on package type)
Test Capabilities
  • LIV Sweep & Wavelength Test (Open Short Test, Current Leakage, Forward Voltage, Operating Current, Operating Voltage, Optical Operating Power, Power Conversion Efficiency (PCE), Threshold Current, Differential Resistance, Power Slope Efficiency, Linearity (Kink), Diode Voltage Test, Wavelength Test)
  • Far Field Test (Geometrical & Pattern Mass Center Offset, Pattern Angle, Contrast Score, Energy/Power, Uniformity, Field Of Illumination (FOI), Hot Spot, Dot Count, Eye Safety Threshold, Center Intensity, Slope)
  • Tri-Temperature Test (-40°C to 150°C) [Optional]
Test Sites Up to 12 test sites
Test Contact Method Probe Type
Test Socket Options Kelvin/Non-Kelvin
Machine Features Automated GR&R, Automated Golden Unit Monitoring, Automated Retest, Automated Yield Monitoring, Automated OQC Sampling Test

Package Ambient Light Sensor
UPH Up to 2,250 (Depending on package & machine configuration)
Input Options JEDEC Tray
Output Options JEDEC Tray
Reject Options JEDEC Tray
Vision Capabilities
  • Presence/Absence Inspection
  • Positioning Verification
Vision Accuracy (depending on package type)
Test Capabilities
  • Electrical Functional Test, Optical Alignment Test, Sensitivity Test, Light Leakage Test, Sensor Sensor Linearity & Responsivity Test, Spectrum Calibration, Sensor Spectrum Measurement Validation
Test Sites Multiple Test Cells Up to 108 parallel test sites
Test Contact Method Punch Type
Test Socket Options Kelvin/Non-Kelvin
Machine Features Automated Golden Unit Monitoring, Spectrometer Audit Control, Automated GR&R, Automated Retest, Run Time Log, Automated Low Yield Monitoring, UPH Tracker, Automated Test Socket Disable

Package Image Sensor, Endoscope
UPH >500 (Depending on package & machine configuration)
Input Options Customized Tray
Output Options Customized Tray
Reject Options Customized Tray
Vision Capabilities
  • X, Y, Rotation & Z Alignment
Vision Accuracy (depending on package type)
Test Capabilities
  • Electrical Functional Test (DC test, Forward Voltage (Vf), Continuity test, Current Leakage test, Light Leakage test, Voltage and Current Consumption test, Serial Communication test, Frames per second capturing test)
  • Edge Spatial Frequency Response (ESFR) ISO Test Chart [Sharpness; Aliasing; Moire; Lateral Chromatic Abberation; Noise; ISO sensitivity; Resolution; Field of View
  • Dynamic Range Test Chart (Dynamic Range, Flare Light)
  • High Uniformity Illumination Flat Light (Uniformity, Blemishes, Lens Shading, Hot and Dead Pixel Detection)
  • Checker-Board (Sharpness, Distortion, Lateral Chromatic Aberration, Field of View)
  • Color Chart (Color Accuracy)
Test Sites Up to 14 test sites
Test Contact Method Punch Type
Test Socket Options Kelvin/Non-Kelvin
Machine Features Programmable Light Source Color Temperature, Auto X, Y Rotation & Z Alignment, Automated Retest, Automated GR&R

Package Spectrum Sensor
UPH >500 (Depending on package & machine configuration)
Input Options JEDEC Tray
Output Options JEDEC Tray
Reject Options JEDEC Tray
Vision Capabilities
Vision Accuracy (depending on package type)
Test Capabilities
  • Electrical Test, Wavelength + Calibration Ratio Error + Modular Sensitivity Test, Optical Power & Spectrum Test, Functional Test, LED Field of Illumination
Test Sites Up to 70 test sites
Test Contact Method Punch Type
Test Socket Options Kelvin/Non-Kelvin
Machine Features Automated GR&R, Autoamted Retest, Automated Yield Monitoring, Tray Mapping Integration

Package Micro LED
UPH >1,200 (Depending on package & machine configuration)
Input Options REL Board
Output Options REL Board
Reject Options REL Board
Vision Capabilities
  • 2DBC Scanning
  • DUT Alignment
Vision Accuracy (depending on package type)
Test Capabilities
  • Colorimeter Image Test (Luminance, Radiance, Illuminance, Irradiance, Luminous Intensity, Radiant Intensity, CIE Chromaticity Coordinates, Color Scale, Correlated Color Temperature (CCT), Dominant Wavelength, Uniformity, Dead Pixel, Crosstalk)
  • Electrical Functional Test (VF Scan, Pixel Current, Current Consumption, Bias Voltage, Temperature Measurement, I2C & SPI Communication)
Test Sites
Test Contact Method Punch Type
Test Socket Options Kelvin/Non-Kelvin
Machine Features

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