It is a high-performance stereoscopic line-scanning 3D vision inspection handler designed to inspect the quality of dies and wirebonds in the front-end semiconductor process, filtering out the good and bad to reduce yield loss and ensure good packaging quality. In-line operations can be carried out in either single or dual lane to eliminate idle time thus increasing throughputs.
|Package Type||Lead Frame|
|Input/ Output Option||Slot Magazine (Able to integrate with upstream process)|
|Frames per hour (FPH)||>380 (Depending on package & machine configuration)|
|Vision Capabilities||Die Inspection, 2D Inspection, 2D/3D Wirebond Inspection, 2D Cosmetic Inspection, Missing parts, OCV, 2DBC, Height and Dimension Inspection|
|Optional Features||DBC Segregation, Laser Marking|