PM95 Die & Wirebond Inspection Handler

It is a high-performance stereoscopic line-scanning 3D vision inspection handler designed to inspect the quality of dies and wirebonds in the front-end semiconductor process, filtering out the good and bad to reduce yield loss and ensure good packaging quality. In-line operations can be carried out in either single or dual lane to eliminate idle time thus increasing throughputs.

• High scanning speed inline 3D measurement with large FOV at high resolution
• 2D resolution up to 5μm
• Height resolution up to 3μm
• High speed positional accuracy of Die placement in x, y and rotational axis
• Delivers 3D data & color images simultaneously
• Various reject marking module for selection
  (inker, scriber, bristle, puncher, wire breaker, laser cutter and etc)