It offers an all-in-one solution for high volume single or multi-site bare die testing, supporting various types of bare dies for multiple applications.
Input Options | Waffler Pack, Wafer Ring, De-Taper |
Output Options | Waffler Tray, Wafer Reconstruction, Tape & Reel |
Package Type | Bare Die |
Sprint UPH | >1700 |
Test Capabilities | AC Test, DC Test, UIS Test at ambient to hot temperature |
Vision Capabilities |
Top Inspection (Surface Cosmetic, DUT Dimension, 2D Lead) Bottom Inspection (Surface Cosmetic, Pad Dimension, Pad Cosmetic) In-Pocket Inspection (Device Presence/Absence, Device Orientation) |