Pentamaster unveils Burn-in Test Solutions for Power Devices with User Definable Burn-in Profile

Penang, Malaysia (October, 2020) – Pentamaster is proud to unveil our Silicon Carbide (SiC) Burn-in Test Solutions which are designed to define the limits of power devices at wafer and module-level.
Power electronic devices are mostly based on silicon carbide semiconductor materials which are designed to be used as switching elements for power converters. These modules can be commonly found in transportation vehicles, electrical appliances, solar panels, power plants and more.

As the rise in demand actively grows for these power electronic devices, it elevates the level of importance in ensuring that the performance and reliabilities of these devices are able to withstand day-to-day operations and operate at their optimum level. There is a saying, ‘You’ll never know your limits until you’re put to the test’. This simple analogy doesn’t only apply to humans, but also applies to power electronic devices and other critical electronics products.

Burn-in test, a primary test method which applies electrical and thermal stress to the device under test (DUT) continuously for hours to screen out early life failures, therefore improving the quality and reliability.
At Pentamaster, we have the technology to perform burn-in test onto power electronic devices at both wafer and module level.

Both our wafer-level and module power device burn-in test handler are capable to work with multiple test parallelism under wafers form or modules tray-to-tray form, multiple independent driver channels for simultaneous voltage/current measurement and temperature monitoring. Our wafer prober burn-in system are designed with seal chamber for accommodating inert gas such as nitrogen and arc suppression gases.