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Wafer-Level Burn-in

Trooper-BI Series

An automated wafer-level burn-in system that performs combined HTRB and HTGB burn-in testing on multiple SiC/GaN wafers in parallel.

Trooper-BI1
Single Chuck SiC Wafer-Level Burn-in System

Trooper-BI1 is a fully automated single chuck burn-in test handler which offers excellent performance for silicon carbide burn-in in wafer-level.

Chuck Quantity	Single Chuck
Package Type	Silicon Carbide (SiC) Power Device
Wafer Size	6, 8 inch
Input/ Output Option	Wafer Cassette (Up to 2 cassettes)
Die Per Wafer Burn-in Parallelism	700~1800
Total Burn-in Resource (Channels)	700~1800
Number of Wafers Burn-in in 24 Hours	Up to 20 wafers
Measurement Parameters	Vth, IGSS, IDSS, Contact Check

Trooper-BI2
Dual Chuck SiC Wafer-Level Burn-in System

Trooper-BI2 is a fully automated dual chuck burn-in test handler which supports simultaneous burn-in of 2 wafers via our precision active alignment gantry system, automating wafer transfer from cassettes to chucks.

Chuck Quantity	Dual Chuck
Package Type	Silicon Carbide (SiC) Power Device
Wafer Size	6, 8 inch
Input/ Output Option	Wafer Cassette (Up to 2 cassettes)
Die Per Wafer Burn-in Parallelism	700~1800
Total Burn-in Resource (Channels)	1400~3600
Number of Wafers Burn-in in 24 Hours	Up to 40 wafers
Measurement Parameters	Vth, IGSS, IDSS, Contact Check

Trooper-BI4
Quad Chuck SiC Wafer-Level Burn-in System

Trooper-BI4 is a fully automated quad chuck burn-in test handler which supports simultaneous burn-in of 4 wafers via our precision active alignment gantry system, automating wafer transfer from cassettes to chucks.

Chuck Quantity	Quad Chuck
Package Type	Silicon Carbide (SiC) Power Device
Wafer Size	6, 8 inch
Input/ Output Option	Wafer Cassette (Up to 2 cassettes)
Die Per Wafer Burn-in Parallelism	700~1800
Total Burn-in Resource (Channels)	2800~7200
Number of Wafers Burn-in in 24 Hours	Up to 80 wafers
Measurement Parameters	Vth, IGSS, IDSS, Contact Check

Trooper-BI6
Hexa Chuck SiC Wafer-Level Burn-in System

Trooper-BI6 is a fully automated hexa chuck burn-in test handler which supports simultaneous burn-in of 6 wafers via our precision active alignment gantry system, automating wafer transfer from cassettes to chucks.

Chuck Quantity	Hexa Chuck
Package Type	Silicon Carbide (SiC) Power Device
Wafer Size	6, 8 inch
Input/ Output Option	Wafer Cassette (Up to 2 cassettes)
Die Per Wafer Burn-in Parallelism	700~1800
Total Burn-in Resource (Channels)	4200
Number of Wafers Burn-in in 24 Hours	Up to 120 wafers
Measurement Parameters	Vth, IGSS, IDSS, Contact Check

Trooper-BI8-G
Octa Chuck SiC Wafer-Level Burn-in System

Trooper-BI8-G is a fully automated octa chuck burn-in test handler which supports simultaneous burn-in of 8 wafers via our precision active alignment gantry system, automating wafer transfer from cassettes to chucks.

Chuck Quantity	Octa Chuck
Package Type	Silicon Carbide (SiC) Power Device
Wafer Size	6, 8 inch
Input/ Output Option	Wafer Cassette (Up to 2 cassettes)
Die Per Wafer Burn-in Parallelism	4000
Total Burn-in Resource (Channels)	32000
Number of Wafers Burn-in in 24 Hours	Up to 1304 wafers
Measurement Parameters	Contact Check, Pre Vth, HTGB, Post Vth

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