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Wafer-Level Burn-in

Trooper-BI Series

Trooper-BI is a fully automated burn-in system with multiple wafer chucks which offers excellent performance for silicon carbide burn-in at wafer-level. It allows multiple wafers to be burn-in at the same time with our precision active alignment gantry system to automate the handling of wafers from cassettes to the chucks. The handler can support wafer from 6” up to 8” and offers multiple probe tests with thermal chucks temperature that goes up to 200°C.

Trooper-BI1
Single Chuck SiC Wafer-Level Burn-in System

Trooper-BI1 is a fully automated single chuck burn-in test handler which offers excellent performance for silicon carbide burn-in in wafer-level.

Chuck Quantity	Single Chuck
Package Type	Silicon Carbide (SiC) Power Device
Wafer Size	6, 8 inch
Input/ Output Option	Wafer Cassette (Up to 2 cassettes)
Die Per Wafer Burn-in Parallelism	700~1800
Total Burn-in Resource (Channels)	700~1800
Number of Wafers Burn-in in 24 Hours	Up to 20 wafers
Measurement Parameters	Vth, IGSS, IGSS, Contact Check

Trooper-BI2
Dual Chuck SiC Wafer-Level Burn-in System

Trooper-BI2 is a fully automated dual chuck burn-in test handler which supports simultaneous burn-in of 2 wafers via our precision active alignment gantry system, automating wafer transfer from cassettes to chucks.

Chuck Quantity	Dual Chuck
Package Type	Silicon Carbide (SiC) Power Device
Wafer Size	6, 8 inch
Input/ Output Option	Wafer Cassette (Up to 2 cassettes)
Die Per Wafer Burn-in Parallelism	700~1800
Total Burn-in Resource (Channels)	1400~3600
Number of Wafers Burn-in in 24 Hours	Up to 40 wafers
Measurement Parameters	Vth, IGSS, IGSS, Contact Check

Trooper-BI4
Quad Chuck SiC Wafer-Level Burn-in System

Trooper-BI4 is a fully automated quad chuck burn-in test handler which supports simultaneous burn-in of 4 wafers via our precision active alignment gantry system, automating wafer transfer from cassettes to chucks.

Chuck Quantity	Quad Chuck
Package Type	Silicon Carbide (SiC) Power Device
Wafer Size	6, 8 inch
Input/ Output Option	Wafer Cassette (Up to 2 cassettes)
Die Per Wafer Burn-in Parallelism	700~1800
Total Burn-in Resource (Channels)	2800~7200
Number of Wafers Burn-in in 24 Hours	Up to 80 wafers
Measurement Parameters	Vth, IGSS, IGSS, Contact Check

Trooper-BI6
Hexa Chuck SiC Wafer-Level Burn-in System

Trooper-BI6 is a fully automated hexa chuck burn-in test handler which supports simultaneous burn-in of 6 wafers via our precision active alignment gantry system, automating wafer transfer from cassettes to chucks.

Chuck Quantity	Hexa Chuck
Package Type	Silicon Carbide (SiC) Power Device
Wafer Size	6, 8 inch
Input/ Output Option	Wafer Cassette (Up to 2 cassettes)
Die Per Wafer Burn-in Parallelism	700~1800
Total Burn-in Resource (Channels)	4200
Number of Wafers Burn-in in 24 Hours	Up to 120 wafers
Measurement Parameters	Vth, IGSS, IGSS, Contact Check

Trooper-BI8-G
Octa Chuck SiC Wafer-Level Burn-in System

Trooper-BI8-G is a fully automated octa chuck burn-in test handler which supports simultaneous burn-in of 8 wafers via our precision active alignment gantry system, automating wafer transfer from cassettes to chucks.

Chuck Quantity	Octa Chuck
Package Type	Silicon Carbide (SiC) Power Device
Wafer Size	6, 8 inch
Input/ Output Option	Wafer Cassette (Up to 2 cassettes)
Die Per Wafer Burn-in Parallelism	4000
Total Burn-in Resource (Channels)	32000
Number of Wafers Burn-in in 24 Hours	Up to 1304 wafers
Measurement Parameters	Contact Check, Pre Vth, HTGB, Post Vth

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