Die-Level Test
PM52X-KGD Die-Level Test Handler
Delivers an integrated solution combining static and dynamic electrical parametric testing with AOI for pre-packaging Known Good Die (KGD) identification, maximizing yield and performance for SiC/Si base power devices.
| Waffle Pack, Wafer Ring, De-Taper | |
| Waffle Tray, Wafer Reconstruction, Tape & Reel | |
| Die | |
| AC Test, DC Test, UIS Test at ambient to hot temperature | |
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Top Inspection: Surface Cosmetic, DUT Dimension, 2D Lead Bottom Inspection: Surface Cosmetic, Pad Dimension, Pad Cosmetic Probe Positioning In-Pocket Inspection: Device Presence/Absence, Device Orientation |