PM52X-KGD Die-Level Test Handler

It is designed for high volume single or multi-site bare die testing, supporting various types of bare dies for multiple applications. 

Waffle Pack, Wafer Ring, De-Taper
Waffle Tray, Wafer Reconstruction, Tape & Reel
Die
AC Test, DC Test, UIS Test at ambient to hot temperature
Top Inspection: Surface Cosmetic, DUT Dimension, 2D Lead
Bottom Inspection: Surface Cosmetic, Pad Dimension, Pad Cosmetic
Probe Positioning
In-Pocket Inspection: Device Presence/Absence, Device Orientation