PM38 Die Sorter

PM38 Die Sorter

PM38 offers a complete turnkey solution with comprehensive features from wafer input, electrical functional test, stimulus test, 6-sided vision inspection, sorting and tape & reel for semiconductors, optical sensors and integrated circuits. It also provides the capability of component level traceability by reading the 2DBC on the packages.

  • Dynamic force control feature
  • Capable of map file integration
  • Flexible input and output configuration
  • Wide spectrum of tests & vision capabilities
  • Complete turnkey solution
Product Specification
Selection of Packages
  • Semiconductors (Leadless Packages: Discrete DFN, QFN | Leaded Packages: Leaded SOIC, MSOP, TSSOP, TO252, TO263, SOT223, SC70, SOT, SOD, SC79)
  • LEDs
  • MEMS Microphone (Top port/Bottom port)
  • Optical Sensors (Structured Light 3D Sensor, Time of Flight 3D Sensor, Proximity Sensor, Ambient Light Sensor, Spectrum Sensor, 3D Magnetic Sensor)
Sprint UPH >20,000
Input Options 8”, 10”, 12” Wafer Size, De-Taper (Optional)
Output Options Tape & Reel (with auto reel changer), JEDEC Tray
Test Capabilities Electrical Functional Test, Stimulus Test (Sensitivity Test, Signal to Noise Ratio (SNR) Test, LED Wavelength & Radiant Test, Photo Diode Sensitivity Test, Light Current Voltage (LIV) Slope Test, Cross Talk & Measurement Test, Magnetic Test)
Test Sites Up to 8 sites
Vision Capabilities Top Vision Inspection, 2D Pad Measurement, 3D Measurement, Post Seal Inspection, Active Die Inspection, In-Pocket Inspection