PM52-LFA sets the standard for unsingulated lead frames manufacturers by offering high accuracy lead frame attaching with easy and reliable lamination. Bonding techniques offered include solder paste or solder pre-form depending on our customer’s requirements and needs.
With high accuracy AOI system for post-dispense inspection, it ensures that the final product meets stringent requirements before escalating down for the next process.
Package Type | Intelligent Power Modules (IPM), T-PAK |
Input Options | Base Guide Jig Slot Magazine DBC Substrate Slot Magazine Reel (Solder Pre-Form) Lead Frame Slot Magazine Top Cover Slot Magazine Vibrator Bowl (Screws) |
Output Option | Slot Magazine |
UPH | >720 (7 secs dispensing time) |
Dispensing/Screwing Capabilities | Dispensing Method (Volume Measuring Type, Auto Positioning in XYZ Axis using vision & sensor, Real Time Paste Limitation, High Speed Dispensing Module) Dispensing Accuracy (+/-10% volume with 0.01g resolution) Control Method (XYZ Axis User-Friendly Teaching Robotic Dispenser) Screw Tightening Torque (Targeted Torque: 40Kgf.cm) |
Vision Capabilities | Cosmetic Inspection (Glue Width, Glue Length, Missing Glue) |