PM52-DP is a high volume mass production handler designed to automate the die attach process onto DBC substrates with pre-form solder pastes which are fed directly into the handler in reel form.
Input Option | Wafer |
Output Option | JEDEC Tray, Waffle Pack, Lead Frame |
UPH | Up to 7,000 |
Performance | X/Y Placement Accuracy: +/-7um @3secs Theta Placement Accuracy: +/-0.10° @3secs Bond Force: 0.5N to 75N (programmable) |