Our high speed & accuracy laser marking series with great precision and depth control covers a broad range of packages at any level in the semiconductor and electronic industries.

Strip-Level Laser Marking
High speed & accuracy laser marking for molded lead frames and substrates.

PM91

Strip-Level Laser Marking Handler
It is known for its incredible speed & accuracy in laser marking packages of many sizes ranging from big to small, achieved by multiple vision guided cameras for precise marking.

Slot Magazine, Stack Magazine, Box
QFN, SOT, PDIP, SOD, SOJ, VSOP, TSOP [Strips form type]
YV04 Laser, Fiber Laser, Green Laser, UV Light
Mark Inspection

Tray-Level Laser Marking
High speed tray to tray configuration laser marking for semiconductors & MEMS components.

PM92

Tray-Level Laser Marking Handler
It offers high precision tray to tray laser marking solution for multiple marking forms, including text, numbers, barcodes, QR codes and more for product identification and traceability.

JEDEC Tray
QFN, SOT, PDIP, SOD, SOJ, VSOP, TSOT
YV04, Fiber, Green or UV Laser
20W (Fiber Laser)
±30μm
2D Matrix, Symbol & Alphanumeric
Laser Alignment, Pre-Mark Inspection, Post-Mark Inspection

Wafer-Level Laser Marking
Accommodates multiple sizes of wafer ranging from 6”, 8” to 12”.

Trooper-L

Wafer-Level Laser Marking Handler
An innovative wafer-level laser marking handler with advanced features such as automated wafer positioning through vision, live feed laser marking view and solid granite platform with anti-vibration absorbers for high precision laser firing.

Wafer Cassette (6”, 8”, 12”)
Die
UV Laser, Green Laser
5 Watt (UV Laser)
±30μm
±10μm
2D Matrix, Symbol & Alphanumeric
Live Feed View, Wafer Alignment in x, y & θ orientation, Post-Mark Inspection

Laser Ablation
High throughput with maximum precision and stability which improves the quality and application rate of end products.

PM93

Laser Ablation Handler
Fully automated laser ablation handler that features enclosed chambers and strong vacuums to eliminate all dust and debris after every ablation cycle.

Slot Magazine
Width: From 60mm to 100mm
Length: From 200mm up to 300mm
UV Light, Fiber Laser
Frame Orientation, 2DBC Reading, XY Position of Laser, Post-Mark Inspection

Singulated Module/Component Laser Marking
Fully automated and high-speed laser marking for singulated modules/components.

PM91-2D

Singulated Module/Component Laser Marking Handler
It offers a quick and easy way to laser mark singulated modules/components, offering a wide selection of compatible lasers to choose from and advanced post-mark vision validation system to ensure optimum results with high throughput counts.

JEDEC Tray
Singulated Module/Component
YV04, Fiber, Green, UV Laser
Max. 12,000 mm/s
Barcode/2D Matrix, Symbol, Character
XYZ 3-Axis Simultaneous Scanning
3 Watt (YV04 Laser)
35nm
2μm