Post Dicing Vision Inspection
An innovative vision inspection handler that detects defects and alignment errors to ensure the quality of diced semiconductor wafers.
Post Dicing Vision Inspection Handler
It offers a fully automated inspection and metrology solution for post wafer dicing, featuring high-speed and on-the-fly 4-sided inspection system.
| Gel Tray, Pick from Dicer Sawing Table | |
| JEDEC Tray, Canister Bins, Tape & Reel (Optional), Gravity Tube (Optional) | |
| Die (Min. 1.1mm x 1.5mm) | |
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Top Inspection Wafer Alignment, Orientation Surface Cosmetic, Marking, Orientation, 2DID Inspection Bottom & 4-Sided Inspection Surface Cosmetic, Dimension, Crack, Chipping, Pad Length, Pad Width, Pad Contamination, Pad Bridging Post-Seal Inspection Broken Seal, Damage Seal |