Die & Wire Bond Vision Inspection
High performance stereoscopic line-scanning 3D vision handler.
PM95
Die & Wire Bond Vision Inspection Handler
A high-performance stereoscopic line-scanning 3D vision handler designed to inspect the quality of dies and wire bonds in the front-end semiconductor process, filtering out the good and bad to reduce yield loss and ensure good packaging quality.
| Slot Magazine [Able to integrate with upstream process] | |
| Lead Frame | |
| Die Inspection, 2D Inspection, 2D/3D Wire bond Inspection, 2D Cosmetic Inspection, Missing Parts, OCV, 2DBC, Height and Dimension Inspection | |
| DBC Segregation, Laser Marking |